We investigate supplier credit qualification thoroughly, to control the quality since the very beginning. Hong Kong Fly Bird Technology Limited have its own QC team, can monitor and control the quality during the whole process including in-coming, storage, and delivery and etc
Contracted with the global authorities third party testing power, by using the most advance testing machine, each the high precision part is tested strictly to ensure that its stability and compatibility can meet its own specification.
Anti-static, moisture-proof and demage-prevetion method & package will be adopted strictly during the stock and delivery procedure. We undertake the responsibility to return or replace the parts which exactly have quality issues.
*Visual Inspection
*X-ray Inspection
*Marking Permanency Test
*De-capsulation Test
*Pin Assignment Test
*PB Free / RoHS Test
*Electrical Test
*Functional Test
External Visual Inspection (EVI)
The first, and most essential, step for any component evaluation is a thorough inspection process. Our procedure and acceptance standards have been developed in order to detect and report evidence of remarking, resurfacing, and refurbishing.
Marking permanency and resistance to solvents, resurfacing, dimension verification, marking code matching, high-power magnification inspection of body and terminal condition are standard methods within our inspection process. All inspections and observations are reviewed by Quality Engineers to evaluate whether we are seeing a new counterfeiting technique or a manufacturing anomaly.
Radiography (X-ray)
Inspection and analysis of a component to examine hardware integrity and variations between devices within a population. Not all variations, however, mean a counterfeit device. Understanding the manufacturing process and how manufacturer supply chains and engineering controls operate, we can identify when variations are manufacturing-based rather than indicators of counterfeiting.
X-ray system is real-time and can rotate the object on all three axes for outstanding imaging capability and analysis of individual components and assembled boards.
Decapsulation
A destructive test that removes the insulation material of the component to reveal the die. The die is then analyzed for markings and architecture to determine traceability and authenticity of the device. Magnification power of up to 1,000x is necessary to identify die markings and surface anamolies.
